Electronic Manufacturing Services (EMS) Offerings and Capabilities:

Printed Circuit Board Assembly

• In-line, high speed SMT assembly line –30,000 placements per hour capacity –0.013” pitch placement accuracy for up to 52mm size devices –0402 components
• In-line, flexible SMT assembly line –15,000 placements per hour capacity –Up to 18” x 18” boards –0201 component, mini, and micro BGAs with ball recognition –0.012” pitch placement accuracy for up to 54mm devices –Nitrogen capable reflow
• Prototype/low volume SMT assembly process.
• X-ray inspection –Process monitoring and analysis for BGA and leadless component placement
• BGA rework station
• Semi-automated PTH line
• Hand assembly/soldering

Unit Assembly

Flexible assembly lines allow for production of a variety of electrical and electro-mechanical products

• Low to high volume production
• Custom packaging
• System integration and configuration

Test

• In-circuit test of printed circuit boards: Teradyne 1890
• Flying probe test: Takaya 8400
• Extensive set of test instrumentation
• Infrastructure for testing wireless devices including screen rooms
• Functional test of boards and assembled products/systems
• Environmental stress testing
• HiPot testing