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Capabilities
Electronic Manufacturing Services (EMS) Offerings and Capabilities:
Printed Circuit Board Assembly
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In-line, high speed SMT assembly line –30,000 placements per hour capacity –0.013” pitch placement accuracy for up to 52mm size devices –0402 components
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In-line, flexible SMT assembly line –15,000 placements per hour capacity –Up to 18” x 18” boards –0201 component, mini, and micro BGAs with ball recognition –0.012” pitch placement accuracy for up to 54mm devices –Nitrogen capable reflow
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Prototype/low volume SMT assembly process.
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X-ray inspection –Process monitoring and analysis for BGA and leadless component placement
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BGA rework station
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Semi-automated PTH line
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Hand assembly/soldering
Unit Assembly
Flexible assembly lines allow for production of a variety of electrical and electro-mechanical products
Test
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In-circuit test of printed circuit boards: Teradyne 1890
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Flying probe test: Takaya 8400
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Extensive set of test instrumentation
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Infrastructure for testing wireless devices including screen rooms
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Functional test of boards and assembled products/systems
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Environmental stress testing
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HiPot testing
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