Capabilities

Electronic Manufacturing Services (EMS) Offerings and Capabilities:

Printed Circuit Board Assembly

• In-line, high speed SMT assembly line –30,000 placements per hour capacity –0.013” pitch placement accuracy for up to 52mm size devices –0402 components

• In-line, flexible SMT assembly line –15,000 placements per hour capacity –Up to 18” x 18” boards –0201 component, mini, and micro BGAs with ball recognition –0.012” pitch placement accuracy for up to 54mm devices –Nitrogen capable reflow

• Prototype/low volume SMT assembly process.

• X-ray inspection –Process monitoring and analysis for BGA and leadless component placement

• BGA rework station

• Semi-automated PTH line

• Hand assembly/soldering

Unit Assembly

Flexible assembly lines allow for production of a variety of electrical and electro-mechanical products

• Low to high volume production

• Custom packaging

• System integration and configuration

Test

• In-circuit test of printed circuit boards: Teradyne 1890

• Flying probe test: Takaya 8400

• Extensive set of test instrumentation

• Infrastructure for testing wireless devices including screen rooms

• Functional test of boards and assembled products/systems

• Environmental stress testing

• HiPot testing