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Electronic Manufacturing Services (EMS) Offerings and Capabilities:
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Printed Circuit Board Assembly
- In-line, high speed SMT assembly line –30,000 placements per hour capacity –0.013” pitch placement accuracy for up to 52mm size devices –0402 components
- In-line, flexible SMT assembly line –15,000 placements per hour capacity –Up to 18” x 18” boards –0201 component, mini, and micro BGAs with ball recognition –0.012” pitch placement accuracy for up to 54mm devices –Nitrogen capable reflow
- Prototype/low volume SMT assembly process.
- X-ray inspection –Process monitoring and analysis for BGA and leadless component placement
- BGA rework station
- Semi-automated PTH line
- Hand assembly/soldering
Unit Assembly
Flexible assembly lines allow for production of a variety of electrical and electro-mechanical products
- Low to high volume production
- Custom packaging
- System integration and configuration
Test
- In-circuit test of printed circuit boards: Teradyne 1890
- Flying probe test: Takaya 8400
- Extensive set of test instrumentation
- Infrastructure for testing wireless devices including screen rooms
- Functional test of boards and assembled products/systems
- Environmental stress testing
- HiPot testing
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